Qualcomm, USI to form joint venture for semiconductor module factory in Brazil




NEW DELHI: Today at São Paulo, Qualcomm Technologies and Universal Scientific Industrial (Shanghai) Co., Ltd. (USI) have signed an agreement to form a joint venture.

This joint venture, which remains subject to various closing conditions, would focus on an installation of a semiconductor module facility in São Paulo dedicated to the design, development and fabrication of modules and components for smartphones and IoT devices in Brazil.

The agreement formalizes the non-binding memorandum of understanding signed by the two parties in March 2017 with the Ministry of Science, Technology, Innovation and Communications (MCTIC), the Ministry of Industry, Foreign Trade and Services (MIDC) and Investe Sao Paulo, representing the Sao Paulo State government.

The agreement to form the joint venture is a result of ongoing collaboration among Qualcomm Technologies, USI and the government entities who have been working together to lay the foundation and foster the growth of the semiconductor industry in Brazil, as well as set the conditions for the possible creation of this joint venture.

Building on the heritage and industry leading Qualcomm® technologies, the flagship products of the joint venture will be a line of system in package modules powered by Qualcomm® chipsets and the modules include, in a single component, the radio frequency and digital components for smartphones and IoT devices.

These products are designed to help dramatically simplify the device engineering and manufacturing processes, and should also provide cost and development time savings to OEMs and IoT device manufacturers. Manufacturing these components in Brazil may also assist in the reduction of the import deficit of integrated circuits, by expanding and diversifying the Brazilian production of semiconductors.

“The platforms and solutions of Qualcomm Technologies continue to support and accelerate the mobile industry and beyond,” said Cristiano Amon, president, Qualcomm Incorporated.

“The collaboration between Qualcomm Technologies and USI aims to develop best-in-class solutions for smartphones and IoT system platforms by offering connectivity, security and accessibility that customers need to create innovative products and better user experiences,” Amon added.

“This project should help foster the adoption of IoT in Brazil, as some of the technology platforms being supported by this joint venture will be designed with an eye towards helping to facilitate the development and manufacturing of connected devices beyond smartphones across the country,” said Rafael Steinhauser, senior vice president and president, Qualcomm Latin America.

“USI has been at the forefront of miniaturization technology for more than 15 years. Our track record and experience make us an ideal collaborator for the manufacturing of highly integrated multi-component modules used in smartphones and IoT devices,” said C. Y. Wei, president of USI.

“Brazil is the largest economy in Latin America with a significant growth potential for integrated modules. USI will be utilizing the technological competence of its parent company, ASE, to help build up the semiconductor cluster in Brazil and Latin America. We are excited to be a part of this joint venture that could help boost local employment in the next five years,” he added.

“The creation of this joint venture by world class companies is a major step towards the insertion of Brazil into the global semiconductor chain, accelerating the development of high technology products and creating important competencies in our country by bringing highly specialized jobs to Brazil in the areas of design and manufacturing of semiconductor modules”, says the Minister of Science, Technology, Innovations and Communications, Gilberto Kassab.

The joint venture is likely to be set up in the state of Sao Paulo as a result of the effort and collaboration between the State of Sao Paulo, USI and Qualcomm Technologies. Assuming successful formation, the joint venture is expected to start manufacturing in 2020.

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